Invention Application
- Patent Title: SOLDER SPACER AND ELECTRONIC MODULE COMPRISING SUCH A SPACER
- Patent Title (中): 包括这种间隔器的焊接间隔器和电子模块
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Application No.: US14405094Application Date: 2013-05-23
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Publication No.: US20150173192A1Publication Date: 2015-06-18
- Inventor: Stephane Kohn
- Applicant: SAGEMCOM BROADBAND SAS
- Priority: FR1256100 20120627
- International Application: PCT/EP2013/060676 WO 20130523
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H05K1/11
Abstract:
The invention provides a spacer for soldering comprising an elongate body having one end provided with a tapped hole and an opposite end provided with a transverse bearing surface having a smooth centering peg projecting therefrom, the peg has a longitudinal outer passage extending over at least a fraction of its length as far as the transverse bearing surface to enable molten solder to penetrate by capillarity as far as the transverse bearing surface. The invention also provides a module including such a spacer.
Public/Granted literature
- US09629245B2 Solder spacer and electronic module comprising such a spacer Public/Granted day:2017-04-18
Information query
