Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US14634527Application Date: 2015-02-27
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Publication No.: US20150177621A1Publication Date: 2015-06-25
- Inventor: Jeong Woo LEE , Going Sik Kim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-Si
- Priority: KR10-2012-0086288 20120807
- Main IPC: G03F7/30
- IPC: G03F7/30 ; H05K3/46
Abstract:
Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials.
Information query
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