公开(公告)号：US20150177621A1

公开(公告)日：2015-06-25

申请号：US14634527

申请日：2015-02-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Jeong Woo LEE ,  Going Sik Kim

IPC: G03F7/30 ,  H05K3/46

CPC classification number: G03F7/30 ,  G03F7/095 ,  G03F7/2022 ,  G03F7/2024 ,  H05K1/0284 ,  H05K3/28 ,  H05K3/4673 ,  H05K2201/0195 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0588 ,  H05K2203/1476

Abstract: Disclosed herein is a printed circuit board, including: a base substrate on which a circuit layer is formed; and multi-layer insulating layers formed in a plurality of layers on the base substrate, including the circuit layer, each of the plurality of layers being formed to have a step structure, wherein the multi-layer insulating layer is formed of heterogeneous materials.

Abstract translation: 这里公开了一种印刷电路板，包括：基底，其上形成有电路层; 以及在所述基底基板上形成为多层的多层绝缘层，所述多层绝缘层包括所述电路层，所述多层中的每一层形成为具有台阶结构，其中所述多层绝缘层由异质材料形成。