Invention Application
US20150228416A1 Polymer Frame for a Chip, Such That the Frame Comprises at Least One Via in Series with a Capacitor
审中-公开
用于芯片的聚合物框架，使得框架与电容器串联连接至少一个通孔
- Patent Title: Polymer Frame for a Chip, Such That the Frame Comprises at Least One Via in Series with a Capacitor
- Patent Title (中): 用于芯片的聚合物框架，使得框架与电容器串联连接至少一个通孔
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Application No.: US14555633Application Date: 2014-11-27
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Publication No.: US20150228416A1Publication Date: 2015-08-13
- Inventor: Dror Hurwitz , Alex Huang
- Applicant: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Applicant Address: CN Zhuhai
- Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee: Zhuhai Advanced Chip Carriers & Electronic Substrate Solutions Technologies Co. Ltd.
- Current Assignee Address: CN Zhuhai
- Main IPC: H01G17/00
- IPC: H01G17/00 ; H05K1/18 ; H05K1/11 ; H03H7/01 ; H01G4/008 ; H05K1/02 ; H01F27/28 ; H05K1/16 ; H01G4/12
Abstract:
A chip socket defined by an organic matrix framework, wherein the organic matrix framework comprises at least one via post layer where at least one via through the framework around the socket includes at least one capacitor comprising a lower electrode, a dielectric layer and an upper electrode in contact with the via post.
Public/Granted literature
- US10446335B2 Polymer frame for a chip, such that the frame comprises at least one via in series with a capacitor Public/Granted day:2019-10-15
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