Invention Application
US20150316475A1 THICKNESS DETERMINATION AND LAYER CHARACTERIZATION USING TERAHERTZ SCANNING REFLECTOMETRY
审中-公开
使用TERAHERTZ扫描反射镜测量厚度确定和层厚度
- Patent Title: THICKNESS DETERMINATION AND LAYER CHARACTERIZATION USING TERAHERTZ SCANNING REFLECTOMETRY
- Patent Title (中): 使用TERAHERTZ扫描反射镜测量厚度确定和层厚度
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Application No.: US14795663Application Date: 2015-07-09
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Publication No.: US20150316475A1Publication Date: 2015-11-05
- Inventor: Anis Rahman , Aunik K. Rahman
- Applicant: Applied Research and Photonics, Inc.
- Main IPC: G01N21/55
- IPC: G01N21/55 ; G01N21/3581 ; G01N21/3563 ; G01N21/95 ; G01N33/483
Abstract:
A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion.
Public/Granted literature
- US09909986B2 Thickness determination and layer characterization using terahertz scanning reflectometry Public/Granted day:2018-03-06
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