公开(公告)号：US20150316475A1

公开(公告)日：2015-11-05

申请号：US14795663

申请日：2015-07-09

Applicant: Applied Research and Photonics, Inc.

Inventor： Anis Rahman ,  Aunik K. Rahman

IPC: G01N21/55 ,  G01N21/3581 ,  G01N21/3563 ,  G01N21/95 ,  G01N33/483

CPC classification number: G01N21/55 ,  A61B5/0507 ,  A61B5/444 ,  B82Y20/00 ,  G01N21/3563 ,  G01N21/3581 ,  G01N21/3586 ,  G01N21/9501 ,  G01N33/4833 ,  G01N2021/3568 ,  G01N2201/101 ,  G02F1/353 ,  G02F1/3558 ,  G02F1/361 ,  G02F1/365 ,  G02F2203/13

Abstract: A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion.

Abstract translation: 本文描述了一种太赫兹扫描反射计系统，用于以非常高的分辨率（例如，25nm或更低）的非破坏性和非侵入性方式原位测量聚合物涂层厚度，半导体晶片的表面子表面检查和光谱分布 并以非侵入性方式对生物组织（例如皮肤）的表面和亚表面进行成像。

公开(公告)号：US09239290B2

公开(公告)日：2016-01-19

申请号：US14144155

申请日：2013-12-30

Applicant: Applied Research and Photonics, Inc.

Inventor： Anis Rahman ,  Aunik K. Rahman

IPC: G02B6/00 ,  G01N21/55 ,  B82Y20/00 ,  G02F1/35 ,  G02F1/355 ,  G01N21/3563 ,  G01N21/3586 ,  G02F1/361 ,  G02F1/365

CPC classification number: G01N21/55 ,  B82Y20/00 ,  G01N21/3563 ,  G01N21/3586 ,  G02F1/353 ,  G02F1/3558 ,  G02F1/361 ,  G02F1/365 ,  G02F2203/13

Abstract: A terahertz scanning reflectometer is described herein. A high sensitivity terahertz scanning reflectometer is used to measure dynamic surface deformation and delamination characteristics in real-time. A number of crucial parameters can be extracted from the reflectance measurements such as dynamic deformation, propagation velocity, and final relaxation position. A terahertz reflectometer and spectrometer are used to determine the permeation kinetics and concentration profile of active ingredients in stratum corneum.

公开(公告)号：US09909986B2

公开(公告)日：2018-03-06

申请号：US14795663

申请日：2015-07-09

Applicant: Applied Research and Photonics, Inc.

Inventor： Anis Rahman ,  Aunik K. Rahman

IPC: G02F1/35 ,  G01N21/55 ,  G01N21/95 ,  G01N33/483 ,  G01N21/3581 ,  B82Y20/00 ,  G02F1/355 ,  G01N21/3586 ,  A61B5/05 ,  A61B5/00 ,  G01N21/3563 ,  G02F1/361 ,  G02F1/365

CPC classification number: G01N21/55 ,  A61B5/0507 ,  A61B5/444 ,  B82Y20/00 ,  G01N21/3563 ,  G01N21/3581 ,  G01N21/3586 ,  G01N21/9501 ,  G01N33/4833 ,  G01N2021/3568 ,  G01N2201/101 ,  G02F1/353 ,  G02F1/3558 ,  G02F1/361 ,  G02F1/365 ,  G02F2203/13

Abstract: A terahertz scanning reflectometer system is described herein for in-situ measurement of polymer coating thickness, semiconductor wafer's surface sub-surface inspection in a non-destructive and non-invasive fashion with very high resolution (e.g., 25 nm or lower) and spectral profiling and imaging of surface and sub-surface of biological tissues (e.g., skin) in a non-invasive fashion.