Invention Application
- Patent Title: CONDUCTIVE FILM SUBSTRATE, TRANSPARENT CONDUCTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM
- Patent Title (中): 导电膜基片,透明导电膜及其制造透明导电薄膜的方法
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Application No.: US14780529Application Date: 2014-03-03
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Publication No.: US20160044778A1Publication Date: 2016-02-11
- Inventor: Tooru Irie , Takahisa Fujimoto , Takashi Kuchiyama , Hironori Hayakawa , Shinya Omoto , Kenji Yamamoto
- Applicant: KANEKA CORPORATION
- Priority: JP2013-063937 20130326; JP2013-087389 20130418
- International Application: PCT/JP2014/055292 WO 20140303
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K3/22 ; H05K3/06 ; H05K3/00 ; H05K1/03 ; H05K1/09

Abstract:
Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 μm or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2θ of the (111) plane of the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.
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