Invention Application
US20160044778A1 CONDUCTIVE FILM SUBSTRATE, TRANSPARENT CONDUCTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM 有权
导电膜基片,透明导电膜及其制造透明导电薄膜的方法

CONDUCTIVE FILM SUBSTRATE, TRANSPARENT CONDUCTIVE FILM, AND METHOD FOR PRODUCING TRANSPARENT CONDUCTIVE FILM
Abstract:
Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 μm or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2θ of the (111) plane of the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.
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