Invention Application
- Patent Title: HIGH SPEED HIGH DENSITY CONNECTOR ASSEMBLY
- Patent Title (中): 高速高密度连接器总成
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Application No.: US14869945Application Date: 2015-09-29
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Publication No.: US20160093985A1Publication Date: 2016-03-31
- Inventor: YUAN ZHANG , AN-JEN YANG , JIE ZHENG , DE-CHENG ZOU , JUN-BIN HUANG , PEI TSAO , JIM ZHAO
- Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED
- Main IPC: H01R13/6594
- IPC: H01R13/6594 ; H01R43/20

Abstract:
An electrical connector assembly includes plural wafers and the corresponding shielding plates are alternately stacked with one another. Each wafer includes a conductive housing defining plural slots therein, and plural terminal modules received in the corresponding slots, respectively. Each of the terminal modules includes a pair of differential contacts and an insulative holder retaining the pair of differential contacts. A plurality of cable assemblies correspond to the corresponding wafers. Each cable assemblies includes a plurality of cables each including a pair of differential wires respectively connected to the pair of differential contacts, respectively.
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