A semiconductor packaging structure including a circuit board, a chip, and a paste is provided. The circuit board includes a base layer, a first circuit layer, and a second circuit layer. The base layer has a first surface, a second surface opposite to the first surface, and a recess located on the first surface. The first circuit layer is located on the first surface. The second circuit layer is located on the second surface. The chip is disposed on the first surface and is electrically connected to first circuit layer, where the recess is located on at least one side of the chip. The paste is filled between the chip and the first surface and filled in the recess, where the paste covers a side surface of the chip.