Invention Application
- Patent Title: CHIP ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
- Patent Title (中): 芯片电子元件和板子
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Application No.: US14671714Application Date: 2015-03-27
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Publication No.: US20160111215A1Publication Date: 2016-04-21
- Inventor: Sang Soo PARK , Soon Ju LEE , Young Ghyu AHN , Heung Kil PARK
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2014-0139021 20141015
- Main IPC: H01G4/30
- IPC: H01G4/30 ; H01G4/012 ; H01G4/224 ; H01C7/10 ; H05K1/02 ; H01L41/083 ; H01C7/00 ; H01G4/12 ; H05K1/18
Abstract:
There is provided a chip electronic component may include: a ceramic body; external electrodes formed on both side portions of the ceramic body; and an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes first and second terminal electrodes formed on both side portions thereof and recesses formed inwardly in the first and second terminal electrodes.
Public/Granted literature
- US09520239B2 Chip electronic component and board having the same Public/Granted day:2016-12-13
Information query
