中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

17 records (took 0.016 seconds)

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME
    2.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME 有权
    多层陶瓷电容器及具有相同功能的板

    公开(公告)号：US20160093441A1

    公开(公告)日：2016-03-31

    申请号：US14668861

    申请日：2015-03-25

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Soon Ju LEE ,  Sang Soo PARK ,  Heung Kil PARK

    IPC: H01G4/30 ,  H01G4/248 ,  H01G2/06 ,  H01G4/12

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/1227 ,  H01G4/232

    Abstract: A multilayer ceramic capacitor (MLCC) includes: first and second metal frames formed on a mounting surface of a ceramic body to be connected to first and second external electrodes providing voltages having opposing polarities, respectively, wherein the first and second metal frames are positioned inwardly of both end surfaces of the ceramic body in a length direction of the ceramic body to be spaced apart from both end surfaces of the ceramic body, respectively.

    Abstract translation: 多层陶瓷电容器（MLCC）包括：形成在陶瓷体的安装表面上的第一和第二金属框架，分别连接到提供具有相反极性的电压的第一和第二外部电极，其中第一和第二金属框架位于内部 陶瓷体的长度方向的两端面分别与陶瓷体的两端面间隔开。

    MOUNTING CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR
    3.
    发明申请
    MOUNTING CIRCUIT BOARD OF MULTILAYER CERAMIC CAPACITOR 有权
    多层陶瓷电容器安装电路板

    公开(公告)号：US20150047887A1

    公开(公告)日：2015-02-19

    申请号：US14146534

    申请日：2014-01-02

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Byoung Hwa LEE ,  Heung Kil PARK ,  Soon Ju LEE ,  Young Ghyu AHN ,  Sang Soo PARK

    IPC: H05K1/02

    CPC classification number: H05K1/111 ,  H01G4/0085 ,  H01G4/12 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: There is provided a mounting circuit board of a multilayer ceramic capacitor including a multilayer ceramic capacitor including a ceramic body in which a plurality of dielectric layers are stacked, an active layer including a plurality of first and second internal electrodes alternately exposed to both end surfaces of the ceramic body, having the dielectric layer therebetween, and first and second external electrodes extended from both end surfaces of the ceramic body to a portion of a lower surface thereof; and a printed circuit board having first and second electrode pads so that the first and second external electrodes are mounted thereon, wherein the first and second electrode pads are disposed in positions diagonally opposed to each other, based on the ceramic body.

    Abstract translation: 提供了一种多层陶瓷电容器的安装电路板，其包括多层陶瓷电容器，该多层陶瓷电容器包括堆叠有多个电介质层的陶瓷体，包括交替暴露于两个端面的多个第一和第二内部电极的有源层 陶瓷体，其间具有电介质层，以及从陶瓷体的两个端面延伸到其下表面的一部分的第一和第二外部电极; 以及印刷电路板，其具有第一和第二电极焊盘，使得第一和第二外部电极安装在其上，其中基于陶瓷体将第一和第二电极焊盘设置在彼此相对的位置。

    ELECTRONIC CHIP COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON
    4.
    发明申请
    ELECTRONIC CHIP COMPONENT AND BOARD HAVING THE SAME MOUNTED THEREON 有权
    电子芯片组件与其安装在一起的板

    公开(公告)号：US20150041195A1

    公开(公告)日：2015-02-12

    申请号：US14137741

    申请日：2013-12-20

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Soon Ju LEE ,  Heung Kil PARK ,  Sang Soo PARK

    IPC: H01G2/06

    CPC classification number: H01G2/065 ,  H01G4/232 ,  H01G4/30 ,  H05K1/0306 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10378 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: An electronic chip component includes a ceramic body; external electrodes formed on end portions of the ceramic body; an interposer supporting the ceramic body and electrically connected to the external electrodes, wherein the interposer includes a first electrode pad formed on a surface thereof and having the external electrodes disposed thereon, a second electrode pad formed on an opposing surface thereof, and a connection electrode pad connecting the first electrode pad to the second electrode pad and formed on a lateral surface between the surface and the opposing surface of the interposer, the first electrode pad is divided into first and second electrode patterns disposed at ends of the interposer based on a space formed therebetween, a non-electrode margin portion is formed between ends of the first electrode pad and ends of the interposer, and the connection electrode pad is formed on the lateral surface of the interposer.

    Abstract translation: 电子芯片部件包括陶瓷体; 外部电极形成在陶瓷体的端部上; 支撑所述陶瓷体并与外部电极电连接的插入件，其中所述插入件包括形成在其表面上并具有设置在其上的外部电极的第一电极焊盘，形成在其相对表面上的第二电极焊盘和连接电极 衬垫，其将第一电极焊盘连接到第二电极焊盘并形成在插入件的表面和相对表面之间的侧表面上，第一电极焊盘被分成基于空间设置在插入器的端部处的第一和第二电极图案 形成在第一电极焊盘的端部和插入件的端部之间的非电极边缘部分，并且连接电极焊盘形成在插入器的侧表面上。

    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON
    8.
    发明申请
    MULTILAYER CERAMIC CAPACITOR AND BOARD HAVING THE SAME MOUNTED THEREON 审中-公开
    多层陶瓷电容器及其安装板

    公开(公告)号：US20140368967A1

    公开(公告)日：2014-12-18

    申请号：US14135338

    申请日：2013-12-19

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Young Ghyu AHN ,  Heung Kil PARK ,  Soon Ju LEE ,  Byoung Hwa LEE ,  Sang Soo PARK

    IPC: H01G4/30 ,  H01G4/005

    CPC classification number: H01G4/30 ,  H01G2/065 ,  H01G4/012 ,  H01G4/232 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10015 ,  H05K2201/2045 ,  Y02P70/611

    Abstract: There is provided a multilayer ceramic capacitor, including: a ceramic body; an active layer including a plurality of first and second internal electrodes; upper and lower cover layers; first and second external electrodes, wherein 0.75×W≦T≦1.25×W, 0.081≦b/(a×(W−b))≦2.267, and 0.267≦c/L≦0.940 are satisfied, where T denotes a thickness of the ceramic body, a denotes a thickness of the lower cover layer, b denotes a width of the first or second internal electrode, L denotes a length of the ceramic body, c denotes a distance between outer edges of the first and second external electrodes, and d denotes a distance between inner edges of the first and second external electrodes.

    Abstract translation: 提供了一种多层陶瓷电容器，包括：陶瓷体; 包括多个第一和第二内部电极的有源层; 上下盖层; 第一外部电极和第二外部电极，其中满足0.75×W＆NlE; T＆amp; NlE; 1.25×W，0.081＆amp; nlE; b /（a×（W-b））＆nlE; 2.267和0.267＆nlE; c / L＆ 陶瓷体的厚度a表示下覆盖层的厚度，b表示第一或第二内部电极的宽度，L表示陶瓷体的长度，c表示第一和第二内部电极的外缘之间的距离 外部电极，d表示第一和第二外部电极的内边缘之间的距离。

    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME
    10.
    发明申请
    ELECTRONIC COMPONENT AND BOARD HAVING THE SAME 有权
    具有相同功能的电子元件和板

    公开(公告)号：US20160217926A1

    公开(公告)日：2016-07-28

    申请号：US15003614

    申请日：2016-01-21

    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

    Inventor： Kyoung Jin JUN ,  Su Jung KIM ,  Young Ghyu AHN ,  Sang Soo PARK ,  Heung Kil PARK ,  Soon Ju LEE

    IPC: H01G4/228 ,  H01G4/30

    CPC classification number: H01G4/228 ,  H01G2/06 ,  H01G4/30

    Abstract: An electronic component and a board having the same are provided. The electronic component according to an exemplary embodiment in the present disclosure may include a body having upper and lower surfaces, first and second side surfaces, and third and fourth side surfaces; external electrodes disposed on at least one of the upper and lower surfaces and the third and fourth side surfaces of the body; and connection terminals disposed on the external electrodes, wherein the connection terminals are disposed inwardly to be spaced apart from an edge of a surface of the body on which the connection terminals are disposed.

    Abstract translation: 提供电子部件和具有该电子部件的电路板。 根据本公开的示例性实施例的电子部件可以包括具有上表面和下表面的主体，第一和第二侧表面以及第三和第四侧表面; 设置在所述主体的上表面和下表面以及所述第三和第四侧表面中的至少一个上的外部电极; 以及设置在外部电极上的连接端子，其中连接端子向内设置成与设置有连接端子的主体的表面的边缘间隔开。

Patent Agency Ranking