Invention Application
US20160111380A1 NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY COATING
审中-公开
微电子封装的新结构与涂层边缘保护
- Patent Title: NEW STRUCTURE OF MICROELECTRONIC PACKAGES WITH EDGE PROTECTION BY COATING
- Patent Title (中): 微电子封装的新结构与涂层边缘保护
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Application No.: US14919696Application Date: 2015-10-21
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Publication No.: US20160111380A1Publication Date: 2016-04-21
- Inventor: Venkatesh SUNDARAM , Vanessa SMET , Rao R. TUMMALA
- Applicant: GEORGIA TECH RESEARCH CORPORATION
- Applicant Address: US GA Atlanta
- Assignee: GEORGIA TECH RESEARCH CORPORATION
- Current Assignee: GEORGIA TECH RESEARCH CORPORATION
- Current Assignee Address: US GA Atlanta
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L21/56 ; H01L23/29 ; H01L21/48 ; H01L23/498 ; H01L23/31
Abstract:
Disclosed herein are edge-coated microelectronic packages comprising a microelectronic package having a top, a bottom, and an exposed edge, and a coating comprising a polymer, wherein the microelectronic package comprises a glass substrate, and wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package. Also disclosed herein are methods of making and using edge-coated microelectronic packages.
Information query
IPC分类:
