公开(公告)号：US20160111380A1

公开(公告)日：2016-04-21

申请号：US14919696

申请日：2015-10-21

Applicant: GEORGIA TECH RESEARCH CORPORATION

Inventor： Venkatesh SUNDARAM ,  Vanessa SMET ,  Rao R. TUMMALA

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/29 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC classification number: H01L23/562 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311

Abstract: Disclosed herein are edge-coated microelectronic packages comprising a microelectronic package having a top, a bottom, and an exposed edge, and a coating comprising a polymer, wherein the microelectronic package comprises a glass substrate, and wherein the coating covers at least a portion of the top, at least a portion of the bottom, and at least a portion of the exposed edge of the microelectronic package. Also disclosed herein are methods of making and using edge-coated microelectronic packages.

Abstract translation: 本文公开了包括具有顶部，底部和暴露边缘的微电子封装的边缘涂覆微电子封装以及包含聚合物的涂层，其中所述微电子封装包括玻璃基板，并且其中所述涂层覆盖至少一部分 顶部，底部的至少一部分以及微电子封装的暴露边缘的至少一部分。 本文还公开了制造和使用边缘涂覆微电子封装的方法。

公开(公告)号：US20160113108A1

公开(公告)日：2016-04-21

申请号：US14919685

申请日：2015-10-21

Applicant: GEORGIA TECH RESEARCH CORPORATION

Inventor： Venkatesh SUNDARAM ,  Sung-Jin Kim ,  Fuhan Liu ,  Srikrishna Sitaraman ,  Rao R. Tummala

IPC: H05K1/02 ,  H05K3/02 ,  H05K3/06 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K3/4697 ,  H05K1/0218 ,  H05K1/183 ,  H05K2201/10083 ,  H05K2203/0733

Abstract: A electromagnetic interference shielding device is disclosed having a first substrate one or more surfaces. One or more laminates are operatively attached to the one or more surfaces of the first substrate. A cavity is provided that is defined by the first substrate and its corresponding one or more laminates and at least one inner lateral portion. The cavity is operable to receive one or more microelectromechanical system (MEMS) components. A first conductive structure integrally formed with a trench or via array of the substrate spans a thickness defined by one or more of surfaces of the first substrate, the first conductive structure operable to shield electromagnetic interference between MEMS components assembled with the first substrate.

Abstract translation: 公开了具有第一基板一个或多个表面的电磁干扰屏蔽装置。 一个或多个层压件可操作地附接到第一基板的一个或多个表面。 提供由第一基板及其对应的一个或多个层压板和至少一个内侧部分限定的空腔。 空腔可操作以接收一个或多个微机电系统（MEMS）部件。 与衬底的沟槽或通孔阵列整体形成的第一导电结构跨越由第一衬底的一个或多个表面限定的厚度，第一导电结构可操作以屏蔽与第一衬底组装的MEMS部件之间的电磁干扰。