Invention Application
- Patent Title: CONDUCTIVE FILM COATED SUBSTRATE, MULTILAYER REFLECTIVE FILM COATED SUBSTRATE, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Patent Title (中): 导电膜涂覆基板,多层反射膜涂层基板,反射掩模布,反射掩模和半导体器件制造方法
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Application No.: US14896411Application Date: 2014-09-22
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Publication No.: US20160124298A1Publication Date: 2016-05-05
- Inventor: Kazuhiro HAMAMOTO , Yoichi USUI
- Applicant: HOYA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: HOYA CORPORATION
- Current Assignee: HOYA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: JP2013-202494 20130927
- International Application: PCT/JP2014/074993 WO 20140922
- Main IPC: G03F1/24
- IPC: G03F1/24 ; G03F7/20 ; B32B7/02

Abstract:
Provided is a conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70−BA30)/(BD70−BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
Public/Granted literature
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