Invention Application
US20160124298A1 CONDUCTIVE FILM COATED SUBSTRATE, MULTILAYER REFLECTIVE FILM COATED SUBSTRATE, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD 有权
导电膜涂覆基板,多层反射膜涂层基板,反射掩模布,反射掩模和半导体器件制造方法

  • Patent Title: CONDUCTIVE FILM COATED SUBSTRATE, MULTILAYER REFLECTIVE FILM COATED SUBSTRATE, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
  • Patent Title (中): 导电膜涂覆基板,多层反射膜涂层基板,反射掩模布,反射掩模和半导体器件制造方法
  • Application No.: US14896411
    Application Date: 2014-09-22
  • Publication No.: US20160124298A1
    Publication Date: 2016-05-05
  • Inventor: Kazuhiro HAMAMOTOYoichi USUI
  • Applicant: HOYA CORPORATION
  • Applicant Address: JP Tokyo
  • Assignee: HOYA CORPORATION
  • Current Assignee: HOYA CORPORATION
  • Current Assignee Address: JP Tokyo
  • Priority: JP2013-202494 20130927
  • International Application: PCT/JP2014/074993 WO 20140922
  • Main IPC: G03F1/24
  • IPC: G03F1/24 G03F7/20 B32B7/02
CONDUCTIVE FILM COATED SUBSTRATE, MULTILAYER REFLECTIVE FILM COATED SUBSTRATE, REFLECTIVE MASK BLANK, REFLECTIVE MASK, AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
Abstract:
Provided is a conductive film coated substrate, including a conductive film formed thereon. In a relationship between a bearing area (%) and a bearing depth (nm) that are obtained by measuring, with an atomic force microscope, a region of 1 μm×1 μm of a surface of the conductive film, the surface of the conductive film satisfies a relationship that (BA70−BA30)/(BD70−BD30) is 15 or more and 260 or less (%/nm), and a maximum height (Rmax) is 1.3 nm or more and 15 nm or less.
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