Invention Application
- Patent Title: SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
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Application No.: US15054677Application Date: 2016-02-26
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Publication No.: US20160181305A1Publication Date: 2016-06-23
- Inventor: Keiji Mabuchi , Hideshi Abe , Hideo Kanbe , Shiro Uchida
- Applicant: Sony Corporation
- Priority: JP2013-228328 20131101
- Main IPC: H01L27/146
- IPC: H01L27/146
Abstract:
A solid-state imaging device includes an Si substrate in which a photoelectric conversion unit that photoelectrically converts visible light incident from a back surface side is formed, and a lower substrate provided under the Si substrate and configured to photoelectrically convert infrared light incident from the back surface side.
Public/Granted literature
- US09831284B2 Method of manufacturing an imaging device Public/Granted day:2017-11-28
Information query
IPC分类:
