Invention Application
US20160203103A1 INTEGRATED FRAMEWORK OF MEMORY STORAGE MODULE AND SENSOR MODULE
审中-公开
内存存储模块和传感器模块的集成框架
- Patent Title: INTEGRATED FRAMEWORK OF MEMORY STORAGE MODULE AND SENSOR MODULE
- Patent Title (中): 内存存储模块和传感器模块的集成框架
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Application No.: US14989824Application Date: 2016-01-07
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Publication No.: US20160203103A1Publication Date: 2016-07-14
- Inventor: Ming Cheng Yu , Min Han Lee , Sin Kuo Cho
- Applicant: Silicon Integrated Systems Corp.
- Applicant Address: TW Hsinchu City
- Assignee: Silicon Integrated Systems Corp.
- Current Assignee: Silicon Integrated Systems Corp.
- Current Assignee Address: TW Hsinchu City
- Priority: TW104100568 20150108
- Main IPC: G06F15/78
- IPC: G06F15/78 ; G06F9/38 ; G06F12/02
Abstract:
An integrated framework of a memory storage module and a sensor module comprises a sensor controller, an embedded memory storage device controller, a microcontroller, and a non-volatile memory. By way of integrating the sensor controller and the embedded memory storage device controller sharing a same microcontroller and a same non-volatile memory, the complexity of packaging and the manufacturing cost are accordingly reduced.
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