Invention Application
- Patent Title: PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 包装及其制造方法
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Application No.: US14686785Application Date: 2015-04-15
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Publication No.: US20160204054A1Publication Date: 2016-07-14
- Inventor: Chao-Min Wang
- Applicant: Subtron Technology Co., Ltd.
- Priority: TW104101087 20150113
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/48 ; H01L21/683 ; B32B37/14 ; B32B37/06
Abstract:
A manufacturing method of a package carrier is provided. A carrier having a connecting surface is provided. A releasable solder resist layer is formed on the connecting surface of the carrier and completely covers the connecting surface. A substrate having an upper surface and a lower surface opposite to each other is provided. A first patterned solder resist layer is formed on the lower surfaces of the substrate and exposes a portion of the lower surface. The carrier and the substrate are laminated, the releasable solder resist layer directly contacts the first patterned solder resist layer, and the carrier is temporarily bonded to the first patterned solder resist layer through the releasable solder resist layer.
Public/Granted literature
- US09668351B2 Package carrier and manufacturing method thereof Public/Granted day:2017-05-30
Information query
IPC分类:
