Invention Application
US20160205767A1 NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY 有权
用于更好的信号质量的新型高速信号路由拓扑

  • Patent Title: NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
  • Patent Title (中): 用于更好的信号质量的新型高速信号路由拓扑
  • Application No.: US14595175
    Application Date: 2015-01-12
  • Publication No.: US20160205767A1
    Publication Date: 2016-07-14
  • Inventor: Yokesh SUBRAMANIAN
  • Applicant: QUALCOMM Incorporated
  • Main IPC: H05K1/02
  • IPC: H05K1/02 H05K1/18
NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
Abstract:
An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.
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