Invention Application
US20160205767A1 NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
有权
用于更好的信号质量的新型高速信号路由拓扑
- Patent Title: NOVEL HIGH SPEED SIGNAL ROUTING TOPOLOGY FOR BETTER SIGNAL QUALITY
- Patent Title (中): 用于更好的信号质量的新型高速信号路由拓扑
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Application No.: US14595175Application Date: 2015-01-12
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Publication No.: US20160205767A1Publication Date: 2016-07-14
- Inventor: Yokesh SUBRAMANIAN
- Applicant: QUALCOMM Incorporated
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18

Abstract:
An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.
Public/Granted literature
- US09980366B2 High speed signal routing topology for better signal quality Public/Granted day:2018-05-22
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