公开(公告)号：US20160205767A1

公开(公告)日：2016-07-14

申请号：US14595175

申请日：2015-01-12

Applicant: QUALCOMM Incorporated

Inventor： Yokesh SUBRAMANIAN

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0213 ,  G11C5/025 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09254

Abstract: An apparatus including an output driver on a PCB and a number of chips on the PCB, the chips including a first chip and a second chip. The PCB includes a first transmission line connected to the output driver, a second transmission line connected to the first transmission line and the first chip, the second transmission line having a length greater than or equal to 10 times a length of the first transmission line, and a third transmission line connected to the first transmission line and the second chip, the third transmission line having a length greater than or equal to 10 times the length of the first transmission line. The second transmission line connects to the first chip without being coupled to a termination resistor on the PCB and the third transmission line connects to the second chip without being coupled to a termination resistor on the PCB.

Abstract translation: 一种包括PCB上的输出驱动器和PCB上的多个芯片的装置，所述芯片包括第一芯片和第二芯片。 PCB包括连接到输出驱动器的第一传输线，连接到第一传输线和第一芯片的第二传输线，第二传输线的长度大于或等于第一传输线的长度的10倍， 以及连接到所述第一传输线和所述第二芯片的第三传输线，所述第三传输线的长度大于或等于所述第一传输线的长度的10倍。 第二传输线连接到第一芯片而不连接到PCB上的终端电阻器，并且第三传输线路连接到第二芯片，而不与PCB上的终端电阻耦合。

公开(公告)号：US20180220524A1

公开(公告)日：2018-08-02

申请号：US15940863

申请日：2018-03-29

Applicant: QUALCOMM Incorporated

Inventor： Yokesh SUBRAMANIAN

IPC: H05K1/02 ,  G11C5/02 ,  H05K1/18

CPC classification number: H05K1/0213 ,  G11C5/025 ,  H05K1/0243 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/025 ,  H05K1/18 ,  H05K2201/09227 ,  H05K2201/09254

Abstract: A method for propagating a signal from an output driver on a PCB to a number of chips on the PCB. The signal is propagated from a first transmission line connected to the output driver, to a second transmission line connected to the first transmission line and a first chip, and to a third transmission line connected to the first transmission line and a second chip. The second transmission line has a length greater than or equal to 10 times the length of the first transmission line, and the third transmission line has a length greater than or equal to 10 times the length of the first transmission line. The lengths of the first transmission line, the second transmission line, and the third transmission line cause a reduction in reflections of the signal due to a change in impedance at a junction of the first, second, and third transmission lines.