Invention Application
US20160205780A1 PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME 审中-公开
印刷电路板,包装及其制造方法

PRINTED CIRCUIT BOARD, PACKAGE AND METHOD OF MANUFACTURING THE SAME
Abstract:
A printed circuit board includes: a core board including, on a first surface thereof, an element mounting part and an element non-mounting part; an insulation layer disposed on the element non-mounting part; a copper-clad laminate plate disposed on the insulation layer; a first penetration via penetrating the insulation layer and the copper-clad laminate plate; and a second penetration via disposed in the core board and connected to the first penetration via.
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