Invention Application
- Patent Title: FLEXIBLE SUBSTRATE
- Patent Title (中): 柔性基板
-
Application No.: US15279657Application Date: 2016-09-29
-
Publication No.: US20170019984A1Publication Date: 2017-01-19
- Inventor: Chin-Tang Hsieh , Fei-Jain Wu , Chia-Jung Tu
- Applicant: CHIPBOND TECHNOLOGY CORPORATION
- Priority: TW104103978 20150205
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03
Abstract:
A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.
Public/Granted literature
- US09961759B2 Flexible substrate Public/Granted day:2018-05-01
Information query
