Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US14831674Application Date: 2015-08-20
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Publication No.: US20170019992A1Publication Date: 2017-01-19
- Inventor: Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
- Applicant: LG INNOTEK CO., LTD.
- Priority: KR10-2015-0100404 20150715
- Main IPC: H05K1/11
- IPC: H05K1/11 ; C25D5/48 ; C25D7/12 ; C25D5/02 ; H05K1/09 ; C25D3/48
Abstract:
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Public/Granted literature
- US09686860B2 Printed circuit board and method of fabricating the same Public/Granted day:2017-06-20
Information query
