Invention Application
- Patent Title: MEMS MICROPHONE
- Patent Title (中): MEMS麦克风
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Application No.: US15119878Application Date: 2015-06-25
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Publication No.: US20170070824A1Publication Date: 2017-03-09
- Inventor: Yonggang HU
- Applicant: CSMC TECHNOLOGIES FAB1 CO., LTD.
- Applicant Address: CN Jiangsu
- Assignee: CSMC TECHNOLOGIES FAB CO., LTD.
- Current Assignee: CSMC TECHNOLOGIES FAB CO., LTD.
- Current Assignee Address: CN Jiangsu
- Priority: CN201410376030.2 20140801
- International Application: PCT/CN2015/082285 WO 20150625
- Main IPC: H04R19/04
- IPC: H04R19/04 ; B81B3/00 ; H04R7/16

Abstract:
A MEMS microphone includes a substrate (100), a supporting part (200), an upper polar plate (300) and a lower polar plate (400). The substrate (100) is provided with an opening (120) penetrating the middle thereof; the lower polar plate (400) straddles the opening (120); the supporting part (200) is fixed on the lower polar plate (400); the upper polar plate (300) is affixed to the supporting part (200); an accommodating cavity (500) is formed among the supporting part (200), the upper polar plate (300) and the lower polar plate (400); a recess (600) opposite to the accommodating cavity (500) is arranged in an intermediate region of at least one of the upper polar plate (300) and the lower polar plate (400), and insulation is achieved between the upper polar plate (300) and a lower polar plate (400).
Public/Granted literature
- US10003890B2 MEMS microphone Public/Granted day:2018-06-19
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