Invention Application
- Patent Title: PRINTED CIRCUIT BOARD
- Patent Title (中): 印刷电路板
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Application No.: US15082020Application Date: 2016-03-28
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Publication No.: US20170079143A1Publication Date: 2017-03-16
- Inventor: Hyung-Gi HA , Jong-Myeon LEE , Jong-Rip KIM
- Applicant: Samsung Electro-Mechanic Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electro-Mechanic Co., Ltd.
- Current Assignee: Samsung Electro-Mechanic Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Priority: KR10-2015-0131016 20150916
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/02
Abstract:
A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.
Public/Granted literature
- US10104767B2 Printed circuit board Public/Granted day:2018-10-16
Information query
