公开(公告)号：US20170079143A1

公开(公告)日：2017-03-16

申请号：US15082020

申请日：2016-03-28

Applicant: Samsung Electro-Mechanic Co., Ltd.

Inventor： Hyung-Gi HA ,  Jong-Myeon LEE ,  Jong-Rip KIM

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/0271 ,  H05K1/185 ,  H05K3/0052 ,  H05K3/0097 ,  H05K2201/09136 ,  H05K2201/09781 ,  H05K2201/10

Abstract: A printed circuit board includes: a strip substrate sectioned into unit areas; electronic components respectively installed in each of the unit areas; and a separation space disposed between the unit areas.

Abstract translation: 印刷电路板包括：条状基板，分成单元区域; 电子元件分别安装在每个单位区域; 以及设置在单元区域之间的分离空间。