Invention Application
- Patent Title: SUBSTRATE TREATMENT APPARATUS, SUBSTRATE TREATMENT METHOD, AND METHOD FOR MANUFACTURING SUBSTRATE
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Application No.: US15441709Application Date: 2017-02-24
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Publication No.: US20170250097A1Publication Date: 2017-08-31
- Inventor: Koichi HAMADA , Nobuo KOBAYASHI
- Applicant: SHIBAURA MECHATRONICS CORPORATION
- Applicant Address: JP Yokohama-shi
- Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee: SHIBAURA MECHATRONICS CORPORATION
- Current Assignee Address: JP Yokohama-shi
- Priority: JP2016-034659 20160225; JP2017-009913 20170124
- Main IPC: H01L21/67
- IPC: H01L21/67 ; H01L21/687 ; G02F1/13 ; H01L21/306

Abstract:
According to an embodiment, a substrate treatment apparatus includes, a substrate support unit supporting a substrate, a rotary unit rotating the substrate, a treatment liquid supply unit supplying treatment liquid to a surface of the substrate, and a controller performing liquid discharge treatment to change liquid discharge velocity at which the treatment liquid is discharged from the substrate, at preset predetermined timing, during substrate treatment in which the treatment liquid is supplied while the substrate is rotated, with the treatment continued.
Public/Granted literature
- US10804121B2 Substrate treatment apparatus, substrate treatment method, and method for manufacturing substrate Public/Granted day:2020-10-13
Information query
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