Invention Application
- Patent Title: SPREAD WEAVE INDUCED SKEW MINIMIZATION
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Application No.: US15161074Application Date: 2016-05-20
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Publication No.: US20170339780A1Publication Date: 2017-11-23
- Inventor: Robert Bisson , Marko Antonic
- Applicant: Robert Bisson , Marko Antonic
- Applicant Address: US MD Hanover
- Assignee: Ciena Corporation
- Current Assignee: Ciena Corporation
- Current Assignee Address: US MD Hanover
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/03 ; H05K3/00 ; G06F17/50 ; H05K1/18 ; H05K3/30
Abstract:
A method of manufacturing a printed circuit board (PCB) includes determining a weft direction of the PCB, and defining a routing design of differential pairs. The routing design is designed to have a fixed region in the weft direction. The method further includes manufacturing the PCB according to the routing design.
Public/Granted literature
- US10402531B2 Spread weave induced skew minimization Public/Granted day:2019-09-03
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