Invention Application
- Patent Title: MEMS DEVICE, LIQUID EJECTING HEAD, LIQUID EJECTING APPARATUS, METHOD FOR MANUFACTURING MEMS DEVICE
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Application No.: US15698459Application Date: 2017-09-07
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Publication No.: US20180093882A1Publication Date: 2018-04-05
- Inventor: Masashi YOSHIIKE
- Applicant: SEIKO EPSON CORPORATION
- Priority: JP2016-192983 20160930
- Main IPC: B81B7/00
- IPC: B81B7/00 ; B41J2/14 ; B41J2/16 ; B81C1/00

Abstract:
There is provided a MEMS device including: a substrate having a resin portion that protrudes from one surface thereof and is made of a resin, in which the first wiring extends along a first direction on the one surface from a position overlapping the resin portion to a position deviating from the resin portion, and in which a width of the resin portion is equal to or larger than a width of the first wiring covering the resin portion in a second direction intersecting the first direction.
Public/Granted literature
- US10246321B2 MEMS device, liquid ejecting head, liquid ejecting apparatus, method for manufacturing MEMS device Public/Granted day:2019-04-02
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