Invention Application
- Patent Title: BACK SIDE ILLUMINATED CMOS IMAGE SENSOR ARRAYS
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Application No.: US15833553Application Date: 2017-12-06
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Publication No.: US20180097025A1Publication Date: 2018-04-05
- Inventor: Hirofumi Komori , Jingyi Bai
- Applicant: CISTA SYSTEM CORP.
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor including at least one pixel for collecting charge in its photodiode is provided. The image sensor comprises: a substrate having a first surface on a front side and a second surface on a back side, a photodetector formed in the silicon substrate and having a light-receiving surface on the second surface, and a first layer with positive charges disposed on the second surface, the first layer being configured to form an electron accumulation region at the light-receiving surface of the photodetector for suppressing a dark current at a back side interface of the image sensor. A method for fabricating an image sensor including a first layer with positive charges is also provided.
Public/Granted literature
- US10741602B2 Back side illuminated CMOS image sensor arrays Public/Granted day:2020-08-11
Information query
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