Invention Application
- Patent Title: Thermal Conducting Sheet, Method for Manufacturing Thermal Conducting Sheet, Heat Dissipation Member, and Semiconductor Device
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Application No.: US16069946Application Date: 2017-01-13
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Publication No.: US20190019739A1Publication Date: 2019-01-17
- Inventor: Hiroki Kanaya , Shinichi Uchida , Keisuke Aramaki
- Applicant: Dexerials Corporation
- Priority: JP2016-005400 20160114; JP2016-254243 20161227
- International Application: PCT/JP2017/001121 WO 20170113
- Main IPC: H01L23/367
- IPC: H01L23/367 ; B32B38/00 ; B32B27/28
Abstract:
Provided is a thermal conducting sheet, including: a binder resin; insulating-coated carbon fibers; and a thermal conducting filler other than the insulating-coated carbon fibers, wherein the insulating-coated carbon fibers include carbon fibers and a coating film over at least a part of a surface of the carbon fibers, the coating film being formed of a cured product of a polymerizable material.
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