Invention Application
- Patent Title: PRINTED CIRCUIT BOARD AND METHOD OF FABRICATING THE SAME
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Application No.: US16717679Application Date: 2019-12-17
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Publication No.: US20200146156A1Publication Date: 2020-05-07
- Inventor: Yun Mi BAE , Soon Gyu KWON , Sang Hwa KIM , Sang Young LEE , Jin Hak LEE , Han Su LEE , Dong Hun JEONG , In Ho JEONG , Dae Young CHOI , Jung Ho HWANG
- Applicant: LG INNOTEK CO., LTD.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@5aeb620d
- Main IPC: H05K3/24
- IPC: H05K3/24 ; H05K1/09 ; H05K3/18 ; H05K3/10 ; H05K1/11
Abstract:
A printed circuit board includes an insulating layer, a circuit pattern on the insulating layer, and a surface treatment layer on the circuit pattern. The surface treatment layer includes a bottom surface having a width wider than a width of a top surface of the circuit pattern.
Public/Granted literature
- US10798827B2 Printed circuit board and method of fabricating the same Public/Granted day:2020-10-06
Information query
