Invention Application
- Patent Title: LOW-PROFILE MECHANICAL RETENTION
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Application No.: US16727581Application Date: 2019-12-26
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Publication No.: US20200147708A1Publication Date: 2020-05-14
- Inventor: Teodor Dabov , John Bernard Ardisana, II , Ashutosh Y. Shukla
- Applicant: Snap Inc.
- Main IPC: B23K1/00
- IPC: B23K1/00 ; G02C11/00 ; H01H13/14 ; B23K1/19 ; B23K33/00 ; H01R12/00 ; H01R13/426

Abstract:
An assembly of mechanical components includes a solder joint between two metal components. A mounted component is retained on one side of a support structure by a solder joint on the other side of the support structure between a retainer and a connector that is fast with the mounted component and extends through the support structure. The retainer is of sheet metal construction, so that a height of the solder joint is no more than the thickness of the retainer, thus providing a low-profile joint.
Public/Granted literature
- US10695852B2 Low-profile mechanical retention Public/Granted day:2020-06-30
Information query
IPC分类: