Invention Application
- Patent Title: SUBSTRATE HOLDER, PLATING DEVICE, AND PLATING METHOD OF SUBSTRATE
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Application No.: US16680451Application Date: 2019-11-11
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Publication No.: US20200161164A1Publication Date: 2020-05-21
- Inventor: Matsutaro MIYAMOTO
- Applicant: EBARA CORPORATION
- Applicant Address: JP Tokyo
- Assignee: EBARA CORPORATION
- Current Assignee: EBARA CORPORATION
- Current Assignee Address: JP Tokyo
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@1ab7876e
- Main IPC: H01L21/687
- IPC: H01L21/687 ; C25D17/06

Abstract:
A substrate holder capable of being used in both single-side plating and double-side plating is required. Disclosed is a substrate holder for holding a substrate to be plated. The substrate holder includes a first frame having a first opening for exposing one surface of the substrate and a second frame having a second opening for exposing the other surface of the substrate, and the substrate is sandwiched between the first frame and the second frame. The substrate holder further includes a dummy substrate which is detachably disposed between the first frame and the substrate and formed of a material that at least direct current does not substantially flow therein. At least a part of the dummy substrate is in contact with at least a part of the one surface of the substrate, and the dummy substrate protects the one surface of the substrate from a plating solution.
Public/Granted literature
- US11232972B2 Substrate holder, plating device, and plating method of substrate Public/Granted day:2022-01-25
Information query
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