Invention Application
- Patent Title: POST-PRODUCTION LAND GRID ARRAY PACKAGE MODIFICATION WITH FIB DEPOSITION
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Application No.: US16564676Application Date: 2019-09-09
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Publication No.: US20210074595A1Publication Date: 2021-03-11
- Inventor: Jeffrey A. Zimmerman , Landon J. Caley , Richard J. Ferguson
- Applicant: BAE Systems Information and Electronic Systems Integration Inc.
- Applicant Address: US NH Nashua
- Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee: BAE Systems Information and Electronic Systems Integration Inc.
- Current Assignee Address: US NH Nashua
- Main IPC: H01L21/66
- IPC: H01L21/66 ; H01L21/48 ; H05K3/22 ; C23C14/22 ; C23C14/14
Abstract:
A method for modifying an LGA package after production is described herein. Generally, a modification of an LGA package by shorting two contacts together via a trace made of a robust conductive metal such as tungsten or platinum. Specifically, the present disclosure relates to a method for modifying a LGA package shorting two contacts together using FIB deposition via a gallium ion beam.
Public/Granted literature
- US11139217B2 Post-production substrate modification with FIB deposition Public/Granted day:2021-10-05
Information query
IPC分类:
