Invention Application
- Patent Title: MEMBRANE FOR EUV LITHOGRAPHY
-
Application No.: US17130537Application Date: 2020-12-22
-
Publication No.: US20210109438A1Publication Date: 2021-04-15
- Inventor: Maxim Aleksandrovich Nasalevich , Erik Achilles Abegg , Nirupam Banerjee , Michiel Alexander Blauw , Derk Servatius Gertruda Brouns , Paul Janssen , Matthias Kruizinga , Egbert Lenderink , Nicolae Maxim , Andrey Nikipelov , Arnoud Willem Notenboom , Claudia Piliego , Mária Péter , Gijsbert Rispens , Nadja Schuh , Marcus Adrianus Van De Kerkhof , Willem Joan Van Der Zande , Pieter-Jan Van Zwol , Antonius Willem Verburg , Johannes Petrus Martinus Bernardus Vermeulen , David Ferdinand Vles , Willem-Pieter Voorthuijzen , Aleksandar Nikolov Zdravkov
- Applicant: ASML NETHERLANDS B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML NETHERLANDS B.V.
- Current Assignee: ASML NETHERLANDS B.V.
- Current Assignee Address: NL Veldhoven
- Priority: EP16166775.3 20160425,EP16195123.1 20161021,EP16205298.9 20161220
- Main IPC: G03F1/62
- IPC: G03F1/62 ; G03F7/20 ; G03F1/82 ; G02B5/20 ; G02B5/28

Abstract:
Membranes for EUV lithography are disclosed. In one arrangement, a membrane has a stack having layers in the following order: a first capping layer including an oxide of a first metal; a base layer including a compound having a second metal and an additional element selected from the group consisting of Si, B, C and N; and a second capping layer including an oxide of a third metal, wherein the first metal is different from the second metal and the third metal is the same as or different from the first metal.
Public/Granted literature
- US11762281B2 Membrane for EUV lithography Public/Granted day:2023-09-19
Information query