Invention Application
- Patent Title: STORAGE DEVICE FOR FLEXIBLE CIRCUIT PACKAGES AND CARRIER THEREOF
-
Application No.: US17470038Application Date: 2021-09-09
-
Publication No.: US20220110209A1Publication Date: 2022-04-07
- Inventor: Shih-Chieh Chang , Hui-Yu Huang , Chih-Ming Peng , Chun-Te Lee
- Applicant: CHIPBOND TECHNOLOGY CORPORATION
- Applicant Address: TW Hsinchu
- Assignee: CHIPBOND TECHNOLOGY CORPORATION
- Current Assignee: CHIPBOND TECHNOLOGY CORPORATION
- Current Assignee Address: TW Hsinchu
- Priority: TW109134779 20201007
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/18 ; H05K1/14

Abstract:
A storage device of the present invention is provided to store flexible circuit packages, each of the flexible circuit packages includes an electronic component and two circuit portions warped at both sides of the electronic component, respectively. The storage device includes a first carrier and a second carrier. The first carrier includes first accommodation elements provided for placement of the flexible circuit packages, and the second carrier includes a first press portion and a second press portion. As the second carrier is placed on the first carrier, the first and second press portions are provided to press the two circuit portions warped upwardly toward the second carrier so as to reduce the warpage of the two circuit portions.
Public/Granted literature
- US11792923B2 Storage device for flexible circuit packages and carrier thereof Public/Granted day:2023-10-17
Information query