Invention Application
- Patent Title: PHOTO RESIST AS OPAQUE APERTURE MASK ON MULTISPECTRAL FILTER ARRAYS
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Application No.: US17584837Application Date: 2022-01-26
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Publication No.: US20220146722A1Publication Date: 2022-05-12
- Inventor: KEVIN R. DOWNING
- Applicant: MATERION CORPORATION
- Applicant Address: US OH MAYFIELD HEIGHTS
- Assignee: MATERION CORPORATION
- Current Assignee: MATERION CORPORATION
- Current Assignee Address: US OH MAYFIELD HEIGHTS
- Main IPC: G02B5/20
- IPC: G02B5/20 ; G03F7/20 ; G03F7/00 ; G03F7/038 ; G03F7/039

Abstract:
An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.
Public/Granted literature
- US11762137B2 Photo resist as opaque aperture mask on multispectral filter arrays Public/Granted day:2023-09-19
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