公开(公告)号：US20220146722A1

公开(公告)日：2022-05-12

申请号：US17584837

申请日：2022-01-26

Applicant: MATERION CORPORATION

Inventor： KEVIN R. DOWNING

IPC: G02B5/20 ,  G03F7/20 ,  G03F7/00 ,  G03F7/038 ,  G03F7/039

Abstract: An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.

公开(公告)号：US20230375761A1

公开(公告)日：2023-11-23

申请号：US18366081

申请日：2023-08-07

Applicant: MATERION CORPORATION

Inventor： KEVIN R. DOWNING

IPC: G02B5/20 ,  G03F7/00 ,  G03F7/038 ,  G03F7/039

CPC classification number: G02B5/201 ,  G03F7/70308 ,  G03F7/0015 ,  G03F7/0382 ,  G03F7/0392

Abstract: An apparatus (e.g., a multi-spectral optical filter array, an optical wafer, an optical component) has an aperture mask printed directly thereon, the aperture mask including a positive or negative photoresist. The apparatus includes a substrate having the aperture mask printed on at least one of a light entrance surface or a light exit surface of the substrate so as to provide an aperture over a portion of the substrate. The photoresist from which the aperture mask is formed is photo-definable or non-photo-definable, and is deposited/printed to form the aperture mask on the substrate.