Invention Application
- Patent Title: COMPOUND SEMICONDUCTOR DEVICE
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Application No.: US17508933Application Date: 2021-10-22
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Publication No.: US20220246751A1Publication Date: 2022-08-04
- Inventor: Sungjae CHANG , Hokyun AHN , Hyunwook JUNG
- Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Applicant Address: KR Daejeon
- Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
- Current Assignee Address: KR Daejeon
- Priority: KR10-2021-0015161 20210203,KR10-2021-0074293 20210608
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/78

Abstract:
Provided is a compound semiconductor device. The compound semiconductor device according to embodiments of the inventive concept includes a first semiconductor layer having a fin extending in a first direction on a substrate, an upper gate electrode extending in a second direction perpendicular to the first direction on the first semiconductor layer, a second semiconductor layer disposed between a sidewall of the fin and the upper gate electrode, a dielectric layer disposed between a top surface of the fin and the upper gate electrode, and a lower gate structure connected to a bottom surface of the first semiconductor layer by passing through the substrate.
Public/Granted literature
- US11916140B2 Compound semiconductor device Public/Granted day:2024-02-27
Information query
IPC分类: