Invention Application
- Patent Title: THIN-FILM DEPOSITION METHODS WITH THERMAL MANAGEMENT OF EVAPORATION SOURCES
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Application No.: US17738050Application Date: 2022-05-06
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Publication No.: US20220259718A1Publication Date: 2022-08-18
- Inventor: Markus Eberhard Beck , Ulrich Alexander Bonne
- Applicant: First Solar, Inc.
- Applicant Address: US AZ Tempe
- Assignee: First Solar, Inc.
- Current Assignee: First Solar, Inc.
- Current Assignee Address: US AZ Tempe
- Main IPC: C23C14/24
- IPC: C23C14/24

Abstract:
An evaporation system comprises an evaporation chamber having an interior enclosed by one or more chamber walls; an evaporation source comprising (i) a source body for containing a feedstock material, and (ii) an evaporation port fluidly coupling the source body with an interior of the evaporation chamber; an insulation material; and a computer-based controller for configuring the insulation material in (i) a first configuration in which the insulation material is disposed snugly around the source body and (ii) a second configuration in which at least a portion of the insulation material is spaced away from the source body and at least a second portion of the insulation material is disposed snugly around the source body; wherein the insulation material does not cover an opening of the evaporation port in the first configuration and the second configuration.
Public/Granted literature
- US11866817B2 Thin-film deposition methods with thermal management of evaporation sources Public/Granted day:2024-01-09
Information query
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