Invention Application
- Patent Title: RESIN COMPOSITION, PREPREG, RESIN-EQUIPPED FILM, RESIN-EQUIPPED METAL FOIL, METAL-CLADDED LAYERED SHEET, AND WIRING BOARD
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Application No.: US17632721Application Date: 2020-07-30
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Publication No.: US20220289969A1Publication Date: 2022-09-15
- Inventor: Masashi KODA , Yuki KITAI , Atsushi WADA , Yasunori HOSHINO
- Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Applicant Address: JP Osaka
- Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- Current Assignee Address: JP Osaka
- Priority: JP2019-145499 20190807
- International Application: PCT/JP2020/029364 WO 20200730
- Main IPC: C08L71/12
- IPC: C08L71/12 ; C08J5/24 ; C08J5/18 ; B32B15/08 ; B32B27/20 ; H05K1/03
Abstract:
An aspect of the present invention is a resin composition containing a modified polyphenylene ether compound of which a terminal is modified with a substituent having a carbon-carbon unsaturated double bond and an inorganic filler, in which the inorganic filler contains silica in which a ratio of a number of Si atoms contained in silanol groups to a total number of Si atoms is 3% or less.
Information query
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