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    COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN
    2.
    发明申请
    COPPER-CLAD LAMINATE, WIRING BOARD, AND COPPER FOIL WITH RESIN 有权

    公开(公告)号：US20230054257A1

    公开(公告)日：2023-02-23

    申请号：US17768170

    申请日：2020-10-15

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yuki INOUE ,  Tatsuya ARISAWA ,  Yuki KITAI

    IPC: B32B15/20 ,  B32B15/082

    Abstract: A copper-clad laminate includes an insulating layer that contains a cured product of a resin composition containing a polymer having a structural unit represented by the following Formula (1) in a molecule, and a metal foil that is laminated on the insulating layer, and in which a chromium element amount, on an exposed surface of the insulating layer exposed by an etching treatment of the copper-clad laminate is 7.5 at % or less with respect to a total element amount on the exposed surface, and ten-point average roughness of the exposed surface is 2.0 μm or less. In Formula (1), Z represents an arylene group, R1 to R3 each independently represent a hydrogen atom or an alkyl group, and R4 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

    PREPREG, AND METAL-CLAD LAMINATED BOARD AND WIRING SUBSTRATE OBTAINED USING SAME
    6.
    发明申请
    PREPREG, AND METAL-CLAD LAMINATED BOARD AND WIRING SUBSTRATE OBTAINED USING SAME 审中-公开

    公开(公告)号：US20200223998A1

    公开(公告)日：2020-07-16

    申请号：US16651069

    申请日：2018-09-28

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yasunori HOSHINO ,  Hiroaki FUJIWARA ,  Yuki KITAI ,  Takayoshi OZEKI ,  Mikio SATO ,  Masashi KODA

    IPC: C08J5/24 ,  H05K1/03

    Abstract: One aspect of the present invention relates to a prepreg having a thermosetting resin composition or a semi-cured product of a thermosetting resin composition, and a fibrous base material, in which the thermosetting resin composition contains (A) a thermosetting resin containing a modified polyphenylene ether compound, (B) a first inorganic filler in which a molybdenum compound is present on at least a part of the surface, and (C) a second inorganic filler, a content of (B) the first inorganic filler is 0.1 parts by weight or more and 15 parts by weight or less, and a content of (C) the second inorganic filler is 200 parts by mass or less, with respect to 100 parts by weight of (A) the thermosetting resin, and the fibrous base material is a glass cloth containing quartz glass yarn.

    PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD
    9.
    发明申请
    PREPREG, METAL-CLAD LAMINATE, AND WIRING BOARD 有权

    公开(公告)号：US20220159830A1

    公开(公告)日：2022-05-19

    申请号：US17440528

    申请日：2020-03-26

    Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

    Inventor： Yasunori HOSHINO ,  Yuki KITAI ,  Atsushi WADA ,  Masashi KODA ,  Mikio SATO

    IPC: H05K1/03 ,  H05K1/05 ,  C08J5/24

    Abstract: A prepreg includes: a resin composition or a semi-cured product thereof; and a fibrous base material, wherein the resin composition contains a polymer having a structural unit expressed by the formula (1) in a molecule, and a curing agent each at a predetermined content rate. A cured product of the resin composition has a Dk of 2.6 to 3.8, and the fibrous base material includes a glass cloth having a Dk of 4.7 or less and a Df of 0.0033 or less. A cured product of the prepreg has a Dk of 2.7 to 3.8, and a Df of 0.002 or less. In the formula (1), Z represents an arylene group, R1 to R3 each independently represents a hydrogen atom or an alkyl group, and R4 to R6 each independently represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms.

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