A module includes: a substrate having a first surface and a second surface; a sealing resin disposed to cover the first surface and an electronic component; a shield film covering an upper surface and a side surface of the sealing resin and a side surface of the substrate; a lowermost layer ground conductor disposed on the second surface; and an internal ground conductor located within the substrate, separated from the second surface, and disposed to be electrically connected to the shield film at the side surface of the substrate. The lowermost layer ground conductor includes portions different in width from each other as seen in a direction perpendicular to the second surface. With the lowermost layer ground conductor and the internal ground conductor seen in this direction, a region occupied by the internal ground conductor is included in a region occupied by the lowermost layer ground conductor.