公开(公告)号：US20230144540A1

公开(公告)日：2023-05-11

申请号：US18149819

申请日：2023-01-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuya ODA

IPC: H05K9/00 ,  H05K3/28

CPC classification number: H05K9/0022 ,  H05K3/284 ,  H05K2203/107 ,  H05K2203/1322 ,  H05K1/181

Abstract: A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of a surface of which on a side distant from the substrate is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers at least a part of a surface of the sealing resin on the side distant from the substrate. The shield film includes a first shield portion superimposed on at least a part of the first conductive film and a second shield portion. The first shield portion is isolated from the second shield portion by a groove that divides the shield film and is provided to such a depth as entering the sealing resin. The first shield portion is electrically independent.

公开(公告)号：US20230141689A1

公开(公告)日：2023-05-11

申请号：US18153051

申请日：2023-01-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuya ODA

IPC: H05K9/00 ,  H05K1/18 ,  H05K3/28

CPC classification number: H05K9/00 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10371 ,  H05K2201/0707

Abstract: A module includes a substrate including a first surface, a first component mounted on the first surface, at least a part of which is covered with a first conductive film, a sealing resin arranged to cover the first surface and the first component, and a shield film that covers a part of a surface of the sealing resin on a side distant from the substrate. The surface of the sealing resin on the side distant from the substrate includes a shielded region covered with the shield film when viewed in a direction perpendicular to the first surface and a non-shielded region not covered with the shield film. The non-shielded region is superimposed on at least a part of the first conductive film.

公开(公告)号：US20170250061A1

公开(公告)日：2017-08-31

申请号：US15427721

申请日：2017-02-08

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Issei YAMAMOTO ,  Atsushi SHIMIZU ,  Yoichi TAKAGI ,  Hideo NAKAGOSHI ,  Toru KOMATSU ,  Hideki SHINKAI ,  Tetsuya ODA

IPC: H01J37/34 ,  C23C14/50 ,  C23C14/56

Abstract: A vacuum device includes a processing target placement unit that is arranged inside a vacuum chamber and a vacuum evacuation unit that is connected to the vacuum chamber. The processing target placement unit has one main surface on which processing targets are placed and a side surface that is connected to the one main surface. The processing target placement unit is provided with a plurality of grooves that have openings at the one main surface. When the processing target placement unit is viewed from the one main surface side thereof, the smallest width of the opening of each groove in the one main surface is equal to or less than half the smallest width of the processing target.

公开(公告)号：US20170048982A1

公开(公告)日：2017-02-16

申请号：US15336941

申请日：2016-10-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Shota ISHIHARA ,  Tetsuya ODA ,  Tatsunori KAN ,  Kenichi ATSUCHI

IPC: H05K1/18 ,  H05K1/11 ,  H05K3/34

CPC classification number: H05K1/185 ,  H05K1/111 ,  H05K3/284 ,  H05K3/34 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10431 ,  H05K2201/10507 ,  H05K2201/10522 ,  H05K2201/10636 ,  H05K2201/10977 ,  H05K2203/048 ,  H05K2203/1316 ,  Y02P70/611 ,  Y02P70/613

Abstract: A bridge section 12 is disposed in an area where mounting sections 11 are opposed to each other such that it is displaced toward a predetermined side. Accordingly, even if the line width of the bridge section 12 is formed larger than that in the related art, the self-alignment phenomenon can occur appropriately in a reflow process. It is thus possible to provide a resin-sealed module having high resin-charging properties and including a circuit substrate on which the bridge section 12 is not broken even if the size of a common land electrode 10 is reduced in accordance with a smaller size of a circuit component 5 and on which a sufficient gap between plural circuit components 5 mounted on the circuit substrate is reliably secured.

Abstract translation: 桥接部分12设置在安装部分11彼此相对的区域中，使得其朝向预定侧移位。 因此，即使桥接部12的线宽比现有技术中的线宽大，也可以在回流工序中适当地进行自对准现象。 因此，可以提供具有高树脂充电性能的树脂密封模块，并且包括电路基板，其中桥接部分12也不会破坏，即使根据较小尺寸的共同接地电极10的尺寸减小 电路部件5可靠地确保安装在电路基板上的多个电路部件5之间的充分的间隙。

公开(公告)号：US20220302012A1

公开(公告)日：2022-09-22

申请号：US17805883

申请日：2022-06-08

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tetsuya ODA

IPC: H01L23/498 ,  H01L23/552

Abstract: A module includes: a substrate having a first surface and a second surface; a sealing resin disposed to cover the first surface and an electronic component; a shield film covering an upper surface and a side surface of the sealing resin and a side surface of the substrate; a lowermost layer ground conductor disposed on the second surface; and an internal ground conductor located within the substrate, separated from the second surface, and disposed to be electrically connected to the shield film at the side surface of the substrate. The lowermost layer ground conductor includes portions different in width from each other as seen in a direction perpendicular to the second surface. With the lowermost layer ground conductor and the internal ground conductor seen in this direction, a region occupied by the internal ground conductor is included in a region occupied by the lowermost layer ground conductor.

公开(公告)号：US20200258797A1

公开(公告)日：2020-08-13

申请号：US16864444

申请日：2020-05-01

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Tetsuya ODA ,  Hideki SHINKAI ,  Toru KOIDESAWA

IPC: H01L23/28 ,  H01L23/538 ,  H05K3/28 ,  H05K3/36

Abstract: A circuit module (100) includes: a substrate (10) including a plurality of inner conductors (2); a first electronic component arranged on one main surface (S1) of the substrate (10); a first resin layer (40) provided on the one main surface (S1) and configured to seal the first electronic component; a plurality of outer electrodes (B1) provided on another main surface (S2) of the substrate (10) and including a ground electrode; a conductor film (50) provided at least on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode with at least one of the plurality of inner conductors (2) interposed therebetween; and a resin film (60).

公开(公告)号：US20210217704A1

公开(公告)日：2021-07-15

申请号：US17212234

申请日：2021-03-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito OTSUBO ,  Tetsuya ODA

IPC: H01L23/552 ,  H01L23/498 ,  H01L25/065

Abstract: A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components and including a trench between any of the plurality of electronic components, a ground electrode arranged on the principal surface, a conductive layer covering the sealing resin, and a magnetic member. The conductive layer is electrically connected to the ground electrode by a connecting conductor arranged so as to penetrate the sealing resin. The magnetic member includes a magnetic plate member arranged so as to cover the sealing resin and a magnetic wall member arranged in a wall shape in the trench. The connecting conductor and the magnetic wall member both fill the trench in a state of being formed in the trench.

公开(公告)号：US20210210438A1

公开(公告)日：2021-07-08

申请号：US17210630

申请日：2021-03-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Shin FURUYA ,  Toru KOIDESAWA ,  Motohiko KUSUNOKI ,  Tetsuya ODA

IPC: H01L23/552 ,  H01L23/29 ,  H05K9/00 ,  H05K1/18 ,  H05K3/28 ,  H01L21/56

Abstract: A module includes: a substrate having a main surface and a side surface; an electronic component mounted on the main surface; a sealing resin that covers the main surface and the electronic component; and a shield film that covers a surface of the sealing resin and the side surface of the substrate. The sealing resin includes: a resin component containing an organic resin as a main component; and a granular filler containing an inorganic oxide as a main component. On a surface of the sealing resin, which is in contact with the shield film, parts of some grains of the filler are exposed from the resin component, a surface of the resin component includes a nitrogen functional group, and the shield film is formed of a metal that is a passivation metal and a transition metal or an alloy containing the metal.

公开(公告)号：US20200260581A1

公开(公告)日：2020-08-13

申请号：US16860131

申请日：2020-04-28

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Tadashi NOMURA ,  Masahiro INOUE ,  Tetsuya ODA ,  Hideki SHINKAI ,  Toru KOIDESAWA

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/18

Abstract: A circuit module (100) includes a substrate (10) having a plurality of internal conductors (2), a first electronic component disposed on one principal surface (S1) of the substrate (10), a first resin layer (40) provided on the one principal surface (S1) and sealing the first electronic component, a plurality of outer electrodes (B1) provided on the other principal surface (S2) of the substrate (10) and including a ground electrode, a conductor film (50) at least provided on an outer surface of the first resin layer (40) and a side surface (S3) of the substrate (10) and connected to the ground electrode via at least one of the plurality of internal conductors (2), and a resin film (60).