Invention Application
- Patent Title: COPPER ALLOY FILM WITH HIGH STRENGTH AND HIGH CONDUCTIVITY
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Application No.: US17661695Application Date: 2022-05-02
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Publication No.: US20220356546A1Publication Date: 2022-11-10
- Inventor: Herng-Jeng Jou , Jacob L. Smith , Weiming Huang
- Applicant: Apple Inc.
- Applicant Address: US CA Cupertino
- Assignee: Apple Inc.
- Current Assignee: Apple Inc.
- Current Assignee Address: US CA Cupertino
- Main IPC: C22C9/00
- IPC: C22C9/00 ; C23C14/14 ; C23C14/34 ; H01M10/0525 ; H01M4/66 ; C25D3/38
Abstract:
A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.
Public/Granted literature
- US12000030B2 Copper alloy film with high strength and high conductivity Public/Granted day:2024-06-04
Information query
