公开(公告)号：US20220356546A1

公开(公告)日：2022-11-10

申请号：US17661695

申请日：2022-05-02

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Jacob L. Smith ,  Weiming Huang

IPC: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  H01M10/0525 ,  H01M4/66 ,  C25D3/38

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.

公开(公告)号：US12000030B2

公开(公告)日：2024-06-04

申请号：US17661695

申请日：2022-05-02

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Jacob L. Smith ,  Weiming Huang

IPC: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/02 ,  H01M4/66 ,  H01M10/0525

CPC classification number: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/662 ,  H01M10/0525 ,  C22C2200/00 ,  H01M2004/021

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.

公开(公告)号：US20240279777A1

公开(公告)日：2024-08-22

申请号：US18645905

申请日：2024-04-25

Applicant: Apple Inc.

Inventor： Herng-Jeng Jou ,  Jacob L. Smith ,  Weiming Huang

IPC: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/02 ,  H01M4/66 ,  H01M10/0525

CPC classification number: C22C9/00 ,  C23C14/14 ,  C23C14/34 ,  C25D3/38 ,  H01M4/662 ,  H01M10/0525 ,  C22C2200/00 ,  H01M2004/021

Abstract: A method of forming a component can include electrochemically depositing a metallic material onto a carrier component to a thickness of greater than 50 microns. The metallic material can include crystal grains and at least 90% of the crystal grains can include nanotwin boundaries. The metallic material can include a Copper-Silver alloy (Cu—Ag) with between about 0.5-2 at %-Ag.

公开(公告)号：US20250052936A1

公开(公告)日：2025-02-13

申请号：US18505906

申请日：2023-11-09

Applicant: Apple Inc.

Inventor： Shuang Li ,  Brian S. Tryon ,  Jacob L. Smith ,  Naoto Matsuyuki

IPC: G02B5/28 ,  G04G9/00

Abstract: An electronic device may be provided with conductive structures such as conductive housing structures. A visible-light-reflecting coating may be formed on the conductive structures. The coating may have adhesion and transition layers and a thin-film interference filter on the adhesion and transition layers. The thin-film interference filter may be a four-layer interference filter stacked directly onto the adhesion and transition layers and having an uppermost SiCrN layer, a lowermost SiN layer, and interleaved SiH and SiN layers. If desired, an opaque coloring layer such as a Cr layer may be disposed between the interference filter and the adhesion and transition layers. The coating may exhibit a deep red or orange color that has a relatively uniform visual response even when the underlying conductive structures have a three-dimensional shape.

公开(公告)号：US20230296893A1

公开(公告)日：2023-09-21

申请号：US18156327

申请日：2023-01-18

Applicant: Apple Inc.

Inventor： Ivan S. Maric ,  Aidan N. Zimmerman ,  Jason C. Sauers ,  Jia Tao ,  John S. Camp ,  Phil M. Hobson ,  Jacob L. Smith ,  Evan D. Christensen

IPC: G02B27/01

CPC classification number: G02B27/0149 ,  G02B27/0101 ,  G02B2027/0169 ,  G02B2027/0161 ,  G02B2027/0132

Abstract: A head-mounted device may be provided with displays. The displays and lenses through which images on the displays are viewed may be mounted in optical modules. Positioners may be used to move the optical modules towards and away from each other to adjust the head-mounted device to accommodate different user interpupillary distances. To support and guide the optical modules, the optical modules may be slidably mounted to guide rails. The guide rails may be biased against the optical modules using biasing systems. By using the biasing systems, misalignment between the optical modules can be reduced. If desired, guide rail sensors may be used to monitor the positions of the guide rails. In some configurations, the optical modules may be mounted to the guide rails using kinematic mounting.