A semiconductor package includes a first semiconductor chip including a first bonding pad on a first surface of a first substrate, a first through electrode penetrating through the first substrate and electrically connected to the first bonding pad, a first recess with a desired depth in the first substrate from a second surface of the first substrate and exposing an end portion of the first through electrode, and a second bonding pad in the first recess and electrically connected to the first through electrode, a second semiconductor chip stacked on the second surface of the first substrate and including a third bonding pad on a third surface of a second substrate, and a conductive connection member between the second bonding pad and the third bonding pad. At least a portion of the conductive connection member may be in the first recess.