公开(公告)号：US20230179003A1

公开(公告)日：2023-06-08

申请号：US18156400

申请日：2023-01-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gusup KIM ,  Duhyun KIM ,  Jiyong PARK ,  Seongil LEE ,  Wonjea JANG ,  Yongsub JEON

IPC: H02J7/00 ,  H01M50/512 ,  H01M10/42 ,  H01M10/46 ,  H01M10/48 ,  H01M10/44

CPC classification number: H02J7/00302 ,  H02J7/0047 ,  H02J7/00306 ,  H02J7/0013 ,  H01M50/512 ,  H01M10/425 ,  H01M10/46 ,  H01M10/48 ,  H01M10/441 ,  H01M2220/30 ,  H01M2010/4271 ,  H04M1/0216

Abstract: A method for protecting a battery of an electronic device including a plurality of batteries, includes: measuring a total current (Itotal) value output from a charging module while the plurality of batteries are charged via the charging module; detecting a first current (I1) value output to a first battery via a current limiter; calculating a difference between the total current (Itotal) value and the first current (I1) value to estimate a second current (I2) value transferred to a second battery without passing through any current limiter, where the first battery and the second battery are included in the plurality of batteries; and controlling, based on the estimated second current (I2) value, a current of the second battery, which has the second current (I2) value, by controlling opening/closing of a switching module included in a protection circuit module of the second battery.

公开(公告)号：US20240234279A9

公开(公告)日：2024-07-11

申请号：US18490995

申请日：2023-10-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin YIM ,  Jiyong PARK

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/49822 ,  H01L23/3135 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15174 ,  H01L2924/15184

Abstract: A semiconductor package includes a first redistribution structure including a first redistribution layer and a first redistribution bonding pad, the first redistribution bonding pad electrically connected to the first redistribution layer, a first semiconductor chip on the first redistribution structure, and a second redistribution structure on the first semiconductor chip, the second redistribution structure including a second redistribution layer and a second redistribution bonding pad, the second redistribution layer electrically connected to the second redistribution layer. The semiconductor package includes a bonding wire electrically connecting the second redistribution bonding pad and the first redistribution bonding pad to each other, and a molding layer covering at least a portion the first semiconductor chip, the second redistribution structure, and the bonding wire on the first redistribution structure.

公开(公告)号：US20230361051A1

公开(公告)日：2023-11-09

申请号：US18113910

申请日：2023-02-24

Applicant: SAMSUNG ELECTRONICS CO, LTD.

Inventor： Choongbin YIM ,  Hyonchol KIM ,  Sungbum KIM ,  Gitae PARK ,  Jiyong PARK ,  Jinwoo PARK ,  Jongbo SHIM

IPC: H01L25/16 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/562 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L25/16 ,  H01L21/4853 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/81815

Abstract: A semiconductor package includes: a package substrate including a redistribution layer, a lower protective layer, and a plurality of support protrusions, wherein the redistribution layer has first and second pads disposed on the package substrate, wherein the lower protective layer has first openings and a trench, wherein the trench exposes the second pads, and wherein the plurality of support protrusions are disposed in the trench; a semiconductor chip disposed on the package substrate and including connection pads electrically connected to the redistribution layer; an encapsulant disposed on at least a portion of the semiconductor chip; first connection bumps electrically connected to the first pads, respectively; a passive device disposed in the trench of the lower protective layer and electrically connected to the second pads; and a sealant covering at least a portion of the passive device and extending into the trench.

公开(公告)号：US20240099546A1

公开(公告)日：2024-03-28

申请号：US18534096

申请日：2023-12-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jiyong PARK ,  Byunghwan KO ,  Seunghee YI ,  Jeawon LEE ,  Seunggee HONG

IPC: A47L15/30 ,  A47L15/42

CPC classification number: A47L15/30 ,  A47L15/4234 ,  A47L15/4257 ,  A47L15/4278 ,  A47L2501/14 ,  A47L2501/20 ,  A47L2501/22

Abstract: A dishwasher according to an embodiment of the disclosure includes a main body, a tub disposed inside the main body, having a washing chamber formed therein, and having an opening at a front side thereof, a basket configured to be rotatable in a first or second direction inside the tub, a driver configured to supply power to rotate the basket, and a door configured to be rotatable in the first direction based on a rotation of the basket in the first direction so as to open or close the opening of the tub.

公开(公告)号：US20230361018A1

公开(公告)日：2023-11-09

申请号：US18166181

申请日：2023-02-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Choongbin YIM ,  Sungbum KIM ,  Jiyong PARK ,  Jinwoo PARK ,  Jongbo SHIM

IPC: H01L23/498 ,  H10B80/00 ,  H01L23/31

CPC classification number: H01L23/49838 ,  H01L23/3128 ,  H10B80/00 ,  H01L24/16

Abstract: Provided is a semiconductor package including a support wiring structure, a semiconductor chip on the support wiring structure, a cover wiring structure on the semiconductor chip, and a filling member filling between the support wiring structure and the cover wiring structure, wherein the cover wiring structure includes a cavity which extends from a lower surface of the cover wiring structure into the cover wiring structure and in which an upper portion of the semiconductor chip is positioned, and a first slot and a second slot respectively having a first width and a second width in a first horizontal direction, the first slot and the second slot communicating with the cavity, and respectively extending to a first side surface and a second side surface of the cover wiring structure, which are opposite to each other in a second horizontal direction which is orthogonal to the first horizontal direction of the cover wiring structure.

公开(公告)号：US20230186837A1

公开(公告)日：2023-06-15

申请号：US18103691

申请日：2023-01-31

Applicant: Samsung Electronics Co., Ltd.

Inventor： Byeongcheol HYEON ,  Jaehyang LEE ,  Jiyong PARK ,  Taeje PARK

IPC: G09G3/32

CPC classification number: G09G3/32 ,  G09G2300/0408 ,  G09G2300/0452 ,  G09G2310/0264 ,  G09G2320/06 ,  G09G2320/041 ,  G09G2320/0233

Abstract: A display device and a control method therefor are provided. The display device includes: a display panel including a plurality of pixels consisting of a plurality of light emitting devices of different colors; a sensor for sensing a temperature of the display panel; a driver IC for driving the plurality of pixels; a memory storing a plurality of pieces of correction data; and a processor configured to execute the at least one instruction to identify, on the basis of the temperature sensed by the sensor, correction data corresponding to the sensed temperature from among the plurality of pieces of stored correction data, correct image data on the basis of the correction data, and control the driver IC on the basis of the corrected image data.

公开(公告)号：US20240063106A1

公开(公告)日：2024-02-22

申请号：US18180563

申请日：2023-03-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jeonghyun LEE ,  Jiyong PARK ,  Jinwoo PARK

IPC: H01L23/498 ,  H01L23/13 ,  H10B80/00 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/49833 ,  H01L23/13 ,  H10B80/00 ,  H01L21/481 ,  H01L21/56 ,  H01L23/49816 ,  H01L24/16

Abstract: A semiconductor package includes a package substrate, a first semiconductor device on the package substrate, an interposer on the package substrate, and a plurality of conductive structures that spaces apart the first semiconductor device from the interposer, wherein the interposer has a cavity into which a portion of the first semiconductor device is accommodated. The interposer has a plurality of spacers protruding from a bottom surface of the cavity of the interposer. The cavity has an inclined sidewall inclined at a predetermined angle with respect to the lower surface of the interposer. The spacer has an inclined side surface inclined at a predetermined angle with respect to the bottom surface of the cavity.

公开(公告)号：US20230206810A1

公开(公告)日：2023-06-29

申请号：US18115480

申请日：2023-02-28

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihye KIM ,  Jiyong PARK ,  Younghoon CHO

IPC: G09G3/20 ,  G09G3/32

CPC classification number: G09G3/2003 ,  G09G3/32 ,  G09G2320/0242 ,  G09G2320/0666 ,  G09G2320/0686 ,  G09G2354/00 ,  G09G2360/04

Abstract: A display device includes a communicator; a memory; a display panel including a plurality of display modules; and one or more processors. The processor receives position information and corrected pixel value of a first area in a first display module; identifies a pixel corresponding to the first area based on the position information; obtains a correction coefficient corresponding to the identified pixel based on the corrected pixel value and an output pixel value of the identified pixel; obtains correction coefficients corresponding to each of a plurality of remaining pixels based on the correction coefficient and a distance between the identified pixel and each of the remaining pixels and stores same in a memory; processes an input image based on the correction coefficients, and controls the display panel to display the processed input image. The device thereby improves display uniformity between display modules more effectively.

公开(公告)号：US20200286422A1

公开(公告)日：2020-09-10

申请号：US16810259

申请日：2020-03-05

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Younghoon CHO ,  Jiyong PARK ,  Sangkyun IM ,  Minji HAN

IPC: G09G3/32

Abstract: A display device is provided. The display device includes a light emitting diode (LED) module including a plurality of LEDs; a plurality of driving integrated chips (ICs), each of the plurality of driving ICs being configured to apply voltages to a corresponding group of the plurality of LEDs; and a controller. The controller is configured to identify a first voltage corresponding to a first LED from among the plurality of LEDs based on image data, identify a first LED driving voltage as the first voltage or a second voltage based on the first voltage and a reference value, and control a first driving IC, from among the plurality of driving ICs, that corresponds to the first LED based on the first LED driving voltage.

公开(公告)号：US20240429110A1

公开(公告)日：2024-12-26

申请号：US18667838

申请日：2024-05-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jangwoo LEE ,  Hyunglak MA ,  Jiyong PARK ,  Jongbo SHIM

IPC: H01L23/16 ,  H01L23/31 ,  H01L23/498 ,  H01L25/065 ,  H01L25/10

Abstract: A semiconductor package includes a lower package having opposite first and second lower package sides that extend in a first direction; an upper package stacked on the lower package by conductive connection members, the upper package having opposite first and second upper package sides that extend in the first direction, wherein the second upper package side is spaced apart from the second lower package side by a predetermined distance to define an underfill region on an upper surface of the lower package; and an underfill member extending from the underfill region on the upper surface of the lower package to fill a space between the lower package and the upper package.