A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.