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公开(公告)号:US11993740B2
公开(公告)日:2024-05-28
申请号:US17508218
申请日:2021-10-22
Applicant: KANEKA CORPORATION
Inventor: Yuichi Imamura , Keisuke Oguma , Masayoshi Kido
IPC: G02F1/1333 , C09K19/02 , C09K19/38 , C09K19/54 , H05K1/02 , C08F255/02 , C08L51/00
CPC classification number: C09K19/38 , C09K19/02 , C09K19/542 , H05K1/024 , C08F255/023 , C08L51/003 , C09K2219/03 , H05K2201/0141 , H05K2201/0158 , H05K2201/0183
Abstract: The present disclosure provides a low dielectric resin composition having good melt processability and excellent low dielectric characteristics in a high frequency band as compared to low dielectric materials such as liquid crystal polymers. A molded article and a film, each of which is formed from the low dielectric resin composition, a multilayer film obtained by superposing a metal foil on at least one main surface of the film, and a flexible printed wiring board which includes the film are also provided. The present disclosure includes, as a low dielectric resin composition, a resin composition which contains (A) a liquid crystal polymer and (B) a graft-modified polyolefin having a polar group. The low dielectric resin composition has a dielectric constant of 2.80 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0025 or less at a frequency of 10 GHz.
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公开(公告)号:US20220363892A1
公开(公告)日:2022-11-17
申请号:US17873588
申请日:2022-07-26
Applicant: KANEKA CORPORATION
Inventor: Yuichi Imamura , Masayoshi Kido , Takahiro Akinaga
IPC: C08L67/03 , C08F255/08
Abstract: A thermoplastic resin composition having good formability and low dielectric characteristics that have not been achieved by conventional liquid crystal polymer resin compositions, while maintaining excellent heat resistance and flame retardancy of liquid crystal polymers, and usable for information and communication devices used in a high frequency range is provided. A thermoplastic resin composition contains liquid crystal polymers (A) and a modified polyolefin (B) having a polar group. The liquid crystal polymer (A) contains a first liquid crystal polymer (a-1) that has a melting point of less than 300° C. and a second liquid crystal polymer (a-2) that has a melting point of 300° C. or more. It is preferable for the thermoplastic resin composition that the phase structure is a sea-island structure or a bicontinuous structure, and the second liquid crystal polymer (a-2) is contained at least in a sea phase or a continuous phase.
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